At the recently concluded ICCAD 2017, a set of impressive data once again captured global attention on China’s integrated circuit (IC) design industry. In 2017, the sales revenue of China's IC design sector is expected to reach 194.598 billion yuan, marking a year-on-year growth of 28.15%! According to the "National Integrated Circuit Industry Development Promotion Outline," the total sales of China's IC design industry are projected to hit 350 billion yuan by 2020, already surpassing the initial target of 150 billion yuan. To maintain this high-growth trajectory, it is clear that China's IC design sector must continue developing more advanced technologies and expanding into new markets. As China emerges as a major global automotive manufacturer, its share in the automotive semiconductor market is expected to grow significantly.
Research firm IC Insights’ latest semiconductor industry driver report highlights that the automotive semiconductor market will become the most powerful chip application market by 2021, outpacing sectors like PCs, communications, and consumer electronics. In 2017, automotive IC sales volume increased by 22%, with an expected 16% growth in 2018. This booming market has attracted significant interest from companies like Fujitsu Semiconductor, which participated in ICCAD 2017. Automotive IC foundry is one of the company’s most critical business areas.
Figure 1: Luo Liangfu, Marketing Director of Triple Fujitsu, shares insights on car-level chip development and quality management.
“New energy vehicles and autonomous driving technologies have raised the bar for chip quality. The capabilities in chip design, IP resources, and foundry process stability have become key factors,†said Luo Liangfu, Market Minister of Triple Fujitsu Semiconductor Co., Ltd., at the “FOUNDRY and Process Technology†special forum held during ICCAD 2017. “As a leading global foundry company, we are optimistic about China’s automotive design and manufacturing prospects. Triple Fujitsu aims to be a driving force behind the rapid growth of China’s IC design industry.â€
**Using Foundry to Support Chip Design Upgrades**
With the surge in smart vehicles and autonomous driving, the product forms and application functions are becoming increasingly diverse, including vehicle control systems, intelligent rearview mirrors, tire pressure monitoring, and ADAS radar. Behind this vibrant automotive chip market, China’s IC design industry is continuously attracting new players, entering fields such as sensors, low-power MCUs, and wireless connectivity solutions. This trend was confirmed by the presence of around 1,380 IC design companies in China, as reported at ICCAD 2017.
Figure 2: Triple Fujitsu has implemented a 55nm process AEC-Q100 Grade 1/2 standard LSI platform.
Luo Liangfu emphasized, “Functional safety is the top priority in automotive chip design and production. High-quality and reliable chips are essential. Ensuring quality from design to manufacturing and fostering collaboration between chip designers and OEMs is crucial.†He added, “We offer our customers an automotive-grade LSI development environment, including proven AEC-Q100 Grade 1/2/3 IP, ISO26262 IP, 5V I/O support, precise PDK, automotive DFM, embedded storage technology, and more.â€
According to Luo Liangfu, Triple Fujitsu has a long history of acquiring a large number of automotive-grade IPs through cooperative purchases, available for customer use. These include DDC technology, embedded memory (eNVM), and RF series IP with high design efficiency. For example, image processors used in autopilot functions (ISP) are widely manufactured by Triple Fujitsu. In the field of automotive radar, the company also develops its own technology and collaborates with the Fujitsu Research Institute to develop millimeter-wave MMIC using CMOS technology. Triple Fujitsu has also prepared a millimeter-wave Process Design Kit (PDK), which will serve as a competitive solution for vehicle radar development.
Figure 3: Triple Fujitsu emphasizes a close collaboration model with customers.
Currently, Triple Fujitsu offers low-power CMOS technology ranging from 40-90nm nodes, along with unique eNVM, RF process options, and millimeter-wave RF technology—key components for many automotive ICs. “We have a rich library of base IPs and have strengthened cooperation with Synopsys, Kilopass, Faraday, and other IP providers to fully meet the needs of IoT chip manufacturing,†Luo Liangfu stated. “These resources are vital for our customers, and we hope to support Chinese companies from the early stages of their design process.â€
Interestingly, as a former IDM supporting line of the Fujitsu Group, Triple Fujitsu, though only three years old, has over 30 years of manufacturing experience. Its 55nm process is highly mature, and the AEC-Q100 Grade 1 standard LSI platform has been adopted by many customers. The 40nm process is also in mass production. “Triple Fujitsu not only has ISO26262-certified intellectual property patents but also provides an automotive industry LSI design environment, including DFM programs, high-precision PDK, and SPICE models, ensuring both quality and stability in foundry manufacturing,†Luo Liangfu explained.
Figure 4: Triple Fujitsu offers multiple solutions to meet different chip manufacturing needs.
**A Multi-Dimensional Strategy for Quality Management**
Beyond meeting various chip manufacturing needs, Triple Fujitsu also provides vehicle-level chip quality management solutions and BCM (Business Continuity Management) disaster prevention measures to ensure continuous supply of customer orders. These services form the foundation of the company’s wafer process yield of over 93%. “This level of yield is critical for maintaining the reliability of automotive chips,†Luo Liangfu noted.
Figure 5: Triple Fujitsu is equipped with an industry-leading factory automation system (MES).
The company employs advanced manufacturing technologies such as Lot/Wafer Tracking, Preferred Tools, WAT Management, and targets zero defect rates. In terms of quality control for automotive chips, in addition to the common AEC-Q100 standard and operating temperature range of -40~125°C, Triple Fujitsu enhances CPK (Process Capability Index) to ≥1.67 and optimizes SPC regulation.
Figure 6: Triple Fujitsu provides quality assurance for automotive chip manufacturing.
In its BCM disaster prevention measures, particularly earthquake response, Triple Fujitsu is the first semiconductor manufacturing plant to adopt a mixed-isolation structure (AVS), with three isolation devices installed between the building and foundation, including plate rubber bearings, rigid plain bearings, and oil dampers. This minimizes the impact of microseisms under normal conditions. Additionally, the company has deployed dual-loop power supplies (NAS batteries and Li-ion capacitors) and LNG auxiliary bases to ensure uninterrupted power supply and stable production.
Luo Liangfu concluded, “To maximize functional safety and life support, Mie Fujitsu always maintains the highest standards for quality and reliability. We comply with ISO14001 for environmental protection and have established ISO9000 series and automotive ISO/TS16949-certified quality assurance systems. Through these measures, we can consistently produce 35,000 12-inch wafers per month.â€
**Opening the Foundry: Embracing the “Shared Economy†Model**
According to industry reports, compared to the traditional off-season in the fourth quarter, there is growing demand for chip manufacturers to increase wafer production in upstream foundries, reflecting ongoing capacity shortages in 2018. SEMI analysis suggests that the Internet of Things and automotive electronics are the main drivers of wafer demand. Meanwhile, among the 1,380 IC design companies in China, 88.62% are small or micro enterprises with fewer than 100 employees. “For these SMEs, the cost of wafer fabrication is a necessary but expensive expense,†Luo Liangfu said. “This affects their ability to test chips and delays time-to-market, potentially causing capital flow issues.â€
At this point, the concept of “shared wafer†has emerged as a viable solution. “Shuttle service is a flexible wafer service launched by Triple Fujitsu for small and medium-sized IC design companies,†Luo Liangfu explained. “Given the long-term demand from numerous small IC design firms, we adapted to the market and introduced this service.†Shuttle service allows multiple customers to share masks and wafers through MPW (Multi-Project Wafer) using 35nm and 40nm CMOS technology, reducing costs. “This streamlined service meets the needs of multiple customers efficiently. Since its launch, Triple Fujitsu has been known for its foundry services, and we believe this will become a top priority for Chinese and global customers alike.â€
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