Megapixel camera chip technology analysis

As early as 2008, high-definition video surveillance has been proposed by the industry, and once became a hot spot of attention, but due to various technologies, costs and actual customer needs at that time, the market for high-definition video surveillance did not actually start. However, from now on, high-definition video surveillance is no longer stuck in the slogan, and various manufacturers have begun to regard it as the key product technology development direction, and also as the focus of marketing. Tiandi Weiye also grasps the trend of the industry, integrates cutting-edge technology and combines mature project applications to launch high-definition video surveillance solutions for various industries. A new generation of video surveillance technology with high-definition, network and intelligent features, as a typical representative of modern security technology, is gaining more and more attention and practical application, it will gradually replace the traditional video surveillance technology. It plays an irreplaceable role in the social security monitoring system.

In the face of an increasingly large market, the increase in demand will bring higher performance and functional requirements. The innovation of core chip technology and the improvement of performance of HD camera products will play a decisive role in the HD video surveillance market. First, let's briefly analyze the common component architecture of current HD camera products. Common HD cameras are divided into three common parts: image sensor, ISP (image signal processor), compression processor or digital video conversion. Some newly released HD cameras on the market also contain an intelligence between the ISP and the compression processor. Analyze the processor.

Megapixel camera chip technology analysis

Image Sensor

Image sensors are an important part of a digital camera. According to the different components, it can be divided into two major categories: CCD and CMOS. Such as SONY's ICX 445, ICX274, IMX035/036, ApTIna's MT9M033, MT9D131, MT9T031, Omnivison's OV2715 and so on. The role of the image sensor is to capture and convert the optical image into electrical signals available to the back end ISP.

In the past, we used to say that CCD is a high-end technology component used in imaging products, and CMOS is limited to low-image quality products due to its low-light performance and exposure mode. Nowadays, CMOS technology is developing rapidly. For example, SONY has introduced the IMX035/036 image sensor using Exmor technology, which has a great performance improvement in low-light performance, image resolution and frame rate, and chip processing speed.

ISP image signal processor

The main function of the ISP (Image Signal Processor) image signal processor is to perform post processing on the signal output from the front end image sensor. Different ISPs are used to match image sensors from different manufacturers. The ISP's excellence is important in the entire camera product, it should be said that it directly affects the quality of the image quality presented to the user. After the image is collected by CCD or CMOS, it needs to be processed in the later stage to better adapt to different environments, and the field details can be better restored under different optical conditions. In the ISP it will do 2A (AWB/AE, Auto White Balance / Auto Exposure) or 3A (AWB / AE / AF, Auto White Balance / Auto Exposure / Auto Focus). In the traditional mode, a DSP or an FPGA is generally used to complete the post processing of the image. Some camera products support 3D noise reduction, wide dynamics, slow shutter, frame accumulation, glare suppression and other functions are also done by ISP.

ISPs currently used in HD camera products generally have the following sources:

Manufacturers develop their own: HD camera equipment manufacturers in order to better cooperate with back-end compression and function development, develop ISP processing algorithms, integrate algorithms into FPGA or DSP chips, and connect front-end image sensors.

Third-party R&D: In 2010, a number of ISP solutions were introduced from non-HD camera manufacturers. They directly sold different ISP chips to camera manufacturers to cooperate with different vendors' Sensors.

Chipset mode: The Sensor manufacturer will develop the image acquisition and processing solution combined with its own Sensor to the customer. The image processing algorithm and various debugging work have been completed. The camera manufacturer only needs to do interface docking and back-end compression or Convert to digital video (HD-SDI). This model is called Stand-Alone Devices or Camera System Onchip.

The first source has a high degree of flexibility, allowing developers to have more combinations when choosing a solution (mainly choosing a vendor from a different vendor). However, for the product, on the one hand, it increases the power consumption and heat dissipation of the whole machine, and also increases the investment in product development. It also means that the manufacturers who develop HD camera products need stronger technical strength. The latter two sources of solutions undoubtedly greatly reduce the threshold for product development, but relatively independent research and development of ISP must increase part of the cost. Imagine that if you have a more integrated HD camera chip solution, it is a better choice to combine ISP and video compression coding.

Compressed processor or digital video conversion

First let's look at the concepts of compression processing and digital video conversion. After the ISP processes the signal of the front-end image sensor, it is generally transmitted to the back-end processing chip in a digital interface format such as MPTE296M/BT.1120/YUV 4:2:2. The compression processor (SoC or DSP) can encode and compress the video signal with the H.264/MPEG-4/MJPEG algorithm, and then transmit it to the user through the network signal of the TCP/IP protocol through the built-in network service. The digital video conversion is an uncompressed mode, and the digital signal outputted by the ISP is converted into an SD-SDI/HD-SDI/3G-SDI signal through a digital video conversion chip, corresponding to a standard definition (VGA) and a high definition standard (1080P@30fps). , 1080P@60fps and even higher resolution. HD-SDI high-definition video signals require dedicated transmission peripherals such as SDI optical transceivers, SDI matrices, and more.

Here, we focus on the compression processor. When we see the parameter performance of a high-definition camera product, we often see the word SoC. The definition of SoC (System On Chip) is various. Because of its wide application range, it is difficult to give a specific definition. Generally speaking, we call it a system-on-chip, also known as a system-on-a-chip, which means that it is a system, a dedicated integrated circuit that contains a complete HD camera system and embeds software services.

Commonly used in the SoC market for high-definition cameras are TI (Texas Instruments), Ambarella (Ambarella), Hislicon (His Semiconductor), and NXP (NXP Semiconductor). Different manufacturers' hardware compression processors have their own characteristics, such as low power consumption, high performance, high video compression quality, and high compression ratio. In the previous article, we mentioned the concept of combining ISP image signal processing with back-end video compression. In the traditional sense, several important devices of the high-definition camera introduced above are separated from each other, and different processing operations are performed by different chips. With the development of SoC chip technology and the general trend of the market, more and more manufacturers have integrated ISP with video compression processing and even intelligent analysis technology to solidify the function in one chip.

The NXP ASC8850 and Hislicon Hi3516 used in HD cameras integrate the image processing functions of 3A, 3D noise reduction, wide dynamic (WDR), strong light suppression, backlight compensation, digital image stabilization, etc. implemented in ISP. The Hi3516 chip is also integrated. Intelligent analysis acceleration engine supports intelligent motion detection, perimeter defense, face detection, lens protection and many other analytical applications. Moreover, these SoC chips also open ISP-related APIs (program interfaces) to our manufacturers, which allows us to develop and optimize the ISP effect secondary adjustment. These chip technologies make the integration of HD cameras more and more, and the integration of chips will be a trend.

The author believes that the development of high-definition camera SoC chips will make technological breakthroughs in power consumption, coding performance, ISP, and intelligent analysis to seek development, which will drive the development of HD camera products.

Lower chip power consumption can make HD cameras smaller, can be used in harsher environments, and derive into a wide variety of HD camera product forms.

Higher encoding performance enables HD cameras to have higher pixel real-time compression capabilities. Most HD chips such as TI's DM368, HiSilicon's Hi3515/3516, and NXP's ASC8850 can achieve 1080P@30fps, 3 megabytes and more. The 5 megapixel level can't be compressed in real time. The higher pixel HD camera can replace the multi-zone monitoring mode of our traditional mode, which can effectively reduce the equipment input cost and the surrounding wiring cost.

At present, most of the video chips with built-in ISP function support the CMOS chip, and can directly connect the main products of the major Sensor manufacturers. However, the support for the CCD chip is relatively limited, and the developer needs to perform the second conversion.

The current high-definition camera with intelligent analysis function reserves a higher frequency DSP or ARM core in the device. The developer can choose to transplant some part or all of the intelligent analysis algorithm to the DSP or ARM. Form an intelligent HD camera with intelligent analysis.

At present, the major SoC vendors in the industry have realized the integration trend of the main control chip, and invested a lot of research and development power in the research and development of the next-generation HD SoC chip. Whether it is the first to launch the ASC8850 NXP and the DM368 TI, or the new Hi3516 Hisilicon Semiconductor has already made achievements in the highly integrated HD camera master chip, and there are also some influential IC manufacturers eager to try. I believe that with the efforts and promotion of chip manufacturers, combined with downstream equipment manufacturers. Driven by market promotion and user demand, the highly integrated next-generation HD camera SoC chip will achieve more and more development and will gradually become a mature industry.

Conclusion

The related chip technology of HD cameras is developing at a high speed. The performance requirements of HD surveillance products are also increasing. The general 720P resolution is already a bit stretched. The demand for 2 megapixel, 3 megapixel or even 5 megapixel HD cameras is constantly emerging. These requirements pose greater challenges to the performance of related chips in HD cameras. Realizing the full range of high-definition video surveillance, it is bound to support high-definition video surveillance from high-definition front-end products to network transmission, centralized storage, display control, and platform management.

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