With the expansion of the application of microelectronic technology, low-cost, miniaturized and high-performance requirements in harsh environments have been proposed for microelectronic circuit components. This is bound to promote the transformation of substrate materials for thick film circuits. Against this background, metal substrates have attracted widespread attention. The metal substrate has high mechanical strength, good thermal conductivity, can be formed into a large size and a complicated shape, and has the advantages of electromagnetic shielding performance and low cost. In particular, insulating substrates with aluminum and steel as the core layer (the outer surface is a ceramic glaze layer) have achieved some successful applications. Such as the electronic hood of automobiles, the conventional ceramic substrate can not meet the requirements of long-term high temperature and mechanical stress, and the metal substrate can solve this problem well. For example, for those electronic components that require electromagnetic shielding, if metal The material is used as a circuit substrate, which can not only meet the needs of anti-electromagnetic interference, but also reduce the size and cost. In addition, the use of steel core ferromagnetism can also produce a compact engine. Due to the limitations of production costs, operating temperature, wet chemical conditions and complex manufacturing processes, the glazed metal substrate has not been widely used. The high-temperature sintered refractory dielectric coating on the stainless steel plate overcomes the shortcomings of the glazed metal substrate.
Remove the dirt and grease on the surface of the steel plate with acetone and other organic solvents, and then roughen and pre-oxidize the surface of the steel plate to improve the wettability and binding force of the dielectric layer and the steel plate. Roughening is to grind the surface of the steel plate in the air, and pre-oxidation is to heat it to 850930 ℃ in a mesh belt furnace for 45 minutes. There are many types of media covering materials, corresponding to different substrates, with different dielectric constants and phase Capacitive. The series of dielectric materials used by American ESL on stainless steel substrates are selected, including pastes for screen printing and low-temperature sintered insulating tape, and their relative dielectric constants are all around 10.
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