The shortage of doctor resources in China and the difficulty of seeing a doctor have plagued each of us. It is necessary to develop wearable medical equipment in such an environment. The market is indeed full of wearable medical equipment. However, most wearable medical products are only swayed by the shackles of “medicalâ€. In fact, there is not much “medical†and “healthâ€. There are also many defects in the design, and it is impossible to give real and effective data to the users. What problems need to be solved for the current wearable medical device market? What other puzzles need to break through?
How to break the power barrier?
Wearable medical devices, like many wearable devices, have a fatal flaw—poor battery life. The key to solving the battery life problem is undoubtedly to increase the battery capacity and reduce the power consumption of the device. In the current technology, configuring the large-capacity battery means increasing the size of the device. I believe that it is easy to weigh the choice. Therefore, in terms of conquering the system's low power challenges, low-power MCUs can solve the energy efficiency of wearable medical devices and effectively extend battery life.
Since the MCU is the core of most wearable devices, the low-power MCU needs to ensure the performance and analog integration of the device when solving the problem of the life of the wearable medical device.
Currently, there are two main MCU solutions in the wearable market: the first is based on the ARM Cortex-M processor and the other is based on the Cortex-A series. Cortex-A series MCUs are the best choice for Android-based wearables, and the Cortex-A series can achieve higher performance, but this solution is difficult to meet the low power requirements of wearable devices. Therefore, most vendors prefer to choose the Cortex-M core MCU. Raman Sharma, director of marketing for Silicon Labs Americas, said the ARM Cortex-M processor-based MCUs provide the best solution for wearable products and are ideal for wearable medical applications.
Raman Sharma, Marketing Director, Silicon Labs Americas
Raman further emphasizes that current low-power MCUs are gradually introducing a sleep mode design that allows for low-power sleep during most of the non-system operating peaks, further reducing overall device power consumption. Silicon Labs' EFM32 Gecko MCU family is the industry's most energy-efficient 32-bit MCU, making it ideal for power-sensitive, battery-powered wearable applications.
The Gecko MCU's low-power sensor interface (LESENSE) and Peripheral Reflection System (PRS) play an important role in the ultra-low power budget of wearable devices. Even when the MCU is in deep sleep mode, the LESENSE interface automatically collects and processes sensor data, which allows the MCU to remain in low power mode for as long as possible while tracking sensor status and events. PRS monitors complex system-level events and allows autonomous communication between different MCU peripherals while keeping the CPU in power-saving sleep mode for as long as possible, reducing overall system power consumption. In addition, most EFM32 MCUs have an analog front end that includes an analog-to-digital converter and an operational amplifier.
How to solve the problem of storage device packaging?
Innovations in portable wearable medical devices have greatly facilitated the need to minimize the size of semiconductor components. These innovations require more data to be stored in a limited form factor. To meet this, many medical device designers are turning to innovative die memory solutions.
Although die is the smallest form of appearance for memory devices, it faces significant challenges in processing, storage, and assembly. The traditional way to use die is to order a single wafer from a semiconductor supplier. However, this requires medical device manufacturers to seek solutions for wafer and bonded wafers. For some manufacturers, this is beyond their capabilities. While these services can be outsourced, an alternative solution is to purchase "in-frame wafers" - some kind of cut wafer. The cut wafer is placed in an adhesive film supported by a metal frame. By ordering such wafers, medical device manufacturers will receive small pieces of die for sorting and placement.
The next challenge is how to electrically connect the die to the application. The traditional approach is to cure the die on the board with epoxy and then wire the leads to electrically connect the die. The die is then packaged in a protective epoxy housing. This is not a simple matter, because of the high requirements for the placement accuracy of the die, special equipment is required. An alternative is to use a bumped die. Such a die has metallized its pads and fixed the pads to the pads. Reflow soldering can be used to connect the bumped die directly down to the PCB. Due to the different thermal expansion (CTE) coefficients of the silicon die and the PCB, the bumped die presents a risk of solder joint shear strain. For this reason, bumped dies are typically filled with additional adhesive at the bottom to provide a stronger mechanical connection and reduce the effects of CTE mismatch.
The latest solution for using die-sized memory devices is chip scale packaging (CSP). The CSP uses a metal redistribution layer (RDL) to connect the pads to new areas with larger contact areas, allowing larger beads to be used. This additional metal RDL is applied at the wafer level using conventional wafer processing tools. The RDL is electrically isolated from the die through the dielectric layer so that it is only connected to the original pad on the die. Then, another dielectric layer is overlaid on the RDL to expose the new larger pad. The larger solder contact area enhances the mechanical connection and eliminates the need to fill the bottom with an adhesive like a bumped die. This results in a die-sized package that can be mounted to the board like any other surface mount device. Microchip Technology currently offers a wide range of EEPROM and flash memory devices using CSP. The CSP package offers a die-level form factor that is critical for portable medical applications while overcoming the technical challenges of using die.
For more information on medical electronic design, please pay attention to the topic "Communication of the core technology of the Internet of Things"
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