Thermal design simulation technology aims at the heat generation mechanism of electronic equipment

Digital trunking communication is a new type of mobile communication system. In addition to the personal mobile communication services provided by the public mobile communication network (GSM, CDMA), it can also realize any communication between individuals and groups, and can be independently edited and controlled. It is an intelligent communication network integrating walkie-talkie, GSM, CDMA and image transmission. The cluster base station is the core equipment of the communication system, and its reliability directly determines the reliability of the digital cluster system. The cluster base station equipment is more and more developed towards large capacity, high power, and high integration. The system's heat consumption density is getting larger and larger, and the environmental adaptability requirements are getting higher and higher, but the volume requirements are getting smaller and smaller, and the thermal reliability Has gradually become the bottleneck of system reliability. Therefore, solving the problem of ventilation and heat dissipation of base station equipment has become an important issue in the design of base station structural systems.

For communication base stations with high thermal power density, thermal design is one of the important contents of system reliability design. When the temperature exceeds a certain value, the failure rate of electronic devices increases exponentially with increasing temperature. Unreasonable cooling is to make One of the main reasons for the reduction of reliability of electronic equipment. The failure of electronic equipment is 20% due to high temperature. A perfect thermal design can greatly improve the reliability of the equipment. Thermal design simulation technology aims at the heat generation mechanism and propagation mode of electronic equipment. It is necessary to analyze and study the thermal field distribution of electronic equipment and adopt reasonable thermal design methods to ensure that electronic equipment works within the allowable temperature range. The electronic cooling analysis software puts the thermal effect analysis of electronic products in the design stage through three aspects: model establishment, model solution and result interpretation, in order to solve the following problems: optimize the structural design parameters of the electronic system; forced convection and natural convection cooling schemes for the electronic system optimize. Computer simulation software in electronic product thermal design has matured in terms of interface, accuracy, reliability, and speed.

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