How do Chinese ICs stand out in the huge automotive electronics market?
In 2009, the annual production volume of Chinese cars has surpassed that of the United States and has become the world's largest car producer. It is expected that the market size of China's automotive electronic products will reach 200 billion yuan in 2010, and in 2011 it is expected to reach 300 billion yuan. With the rise of new energy vehicles in China, the cost ratio of automotive IC products in automobiles will increase from 13.2% to 47% for ordinary cars. Huge business opportunities are facing us. IC manufacturers in Europe, America, Japan, South Korea and other countries have long been As the largest gold mine in the next ten years, if Chinese IC companies are not actively preparing, it will become another tragedy in China's modern industrial history.
MCUs and power ICs are the two largest types of products in automotive semiconductors. MCUs account for 1/4 of the cost ratio. Power ICs account for nearly 20% of the total, ranking second, and in the new generation of electric vehicles, the proportion Even higher, these two markets are the markets that Chinese IC manufacturers must enter, and the two markets they are most likely to enter. However, the current share of Chinese ICs in it is almost negligible, so where is the threshold?
The threshold of automotive IC
At the 2009 'Haixi International Integrated Circuit Design Industry Summit Forum held in Xiamen a few days ago, Dr. Chen Xiaobing, Deputy Director of the Technology Center of Xiamen Jinlong United Automotive Industry Co., Ltd. pointed out that the new generation of hybrid vehicles and electric vehicles will generate many emerging semiconductor application needs, Including multi-channel battery management chip (usually requires hundreds of battery cell detection management), multi-channel battery voltage balance control, high voltage monitoring, large battery detection, large power semiconductor devices and many high-performance MCU and DSP, because of the need To measure and manage complex batteries. The business opportunities here seem limitless.
However, the entry threshold for automotive ICs is quite high. Chen Xiaobing pointed out several important requirements for automotive electronics on chips: the first threshold is the temperature range; the second is high reliability; the third is to have high processing capacity; the fourth It is that MCU should have rich peripheral interfaces and high integration; fifth is that automotive electronics needs powerful proprietary chips. "For example, many companies have launched high-performance automotive power management chips, which can effectively reduce the load of automotive batteries and provide superior failure protection performance: including overvoltage and undervoltage, overcurrent and short circuit protection, overheating and undertemperature protection Wait. It is very helpful to us. Although the price is more expensive, it can greatly reduce our research and development workload and shorten the time. We like to adopt it. "Chen Xiaobing said.
Among the five thresholds, the most important and the hardest to pass is reliability. Chen Xiaobing said: "As car manufacturers, we all hope that automotive ICs can achieve zero defects."
For the operating temperature of automotive electronic components, the International Automobile Association has five grades from -40 to +150 ℃ in Grade 0 to 0 to +70 ℃ in Grade 4. This product verification specification provides a fairly complete definition of the differences in the functions and locations of automotive ICs, and these detailed product verification specifications are of great help to the testing of automotive electronic products.
"However, in terms of reliability, in terms of IC process verification specifications, the International Automotive Electronics Association only focuses on the definition of wafer manufacturing reliability tests. It does not clearly specify the pressure conditions and any specific data standards, and the relevant data, Testing and verification methods are also not required to provide. This brings great difficulty to the design and manufacture of qualified automotive ICs. "Zheng Guodong, director of TSMC's automotive electronics project, pointed out.
Therefore, reliability has become a huge mountain in front of Chinese IC manufacturers. Zheng Guodong explained: "Generally speaking, after the typical wafer production and all test processes are completed, the defect value is 200 to 500 ppm; and when further scanning and functional testing of the logic IC and embedded self-test of the embedded RAM are completed , And speed test, overpressure test, overtemperature test, dynamic voltage strength test, low voltage test and other procedures, we can expect the defect value to drop to 20 ~ 50ppm. "He went on to say," However, this still cannot meet the automotive IC's Zero defect requirement. How can we achieve zero defect? ​​"Zheng Guodong asked?
TSMC's "Vehicle Electronic Package Service" Helps Chinese ICs Realize Zero Defects
Zheng Guodong said that the "vehicle electronic package service" developed by TSMC added the average test of parts (PAT), statistical yield limit (SYL), statistical test result limit (SBL) test, and more strict The control procedures, KLA and WAT tests can reduce the defect value to a level close to "zero". He cited an example: For example, TSMC's 0.25um process of embedded flash memory for vehicles has shipped 540K wafers, and the defect rate is only 0.07ppm; while the 0.18um produced embedded flash memory for vehicles has exceeded the shipment. 20K wafer, the defect value is only 0.05ppm. Embedded flash memory is an important module in automotive MCUs. "The automotive electronic package service includes more stringent process control, component-level screening limits, chip yield test scrap criteria, more statistical process control, and selected manufacturing tools. These measures are combined with customer test coverage And test methods can reduce the actual driving failure rate. "He explained," Before the customer got the chip, the test can be carried out, and the process verification specifications proposed by TSMC are to help customers check from the source, clearly define and data The verification specifications of various chips can ensure that the service life of customers' electronic components greatly exceeds the service life of vehicles. Therefore, this service is also welcomed by our customers. "
"Automotive Electronic Package Service" is the first set of more specific automotive electronic process verification specifications proposed by TSMC at the annual meeting of the International Automotive Electronics Association in 2008, and has been widely accepted and applied by many international automotive electronic semiconductor companies.
Facing the prospects of China's huge automotive electronics market, China Semiconductor Manufacturing Co., Ltd. will help Chinese IC manufacturers obtain tickets to enter the automotive electronics market through automotive electronic package services. He also hopes to use this huge market to upgrade the TSMC Shanghai Songjiang factory Yield. "TSMC's ten wafer fabs in Shanghai and all fabs around the world have successfully built automotive electronic package services. We are betting on various efforts at Shanghai's ten wafer fabs. It is our commitment to support the mainland automotive industry now and The exact action for future growth. "Chen Jiaxiang, general manager of TSMC China Co., Ltd. said. It is reported that the current production volume of TSMC Songjiang Plant is 28,000 pieces / month, which will be increased to 40,000 pieces / month next year. "Currently, the proportion of Chinese ICs in our output is more than 20%, and it is likely to increase to more than 50% next year." Chen Jiaxiang revealed. TSMC's Shenzhen office will also be expanded to prepare for the successful expansion of the plant next year and the increase in the proportion of local ICs.
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