Gore launches acoustic and optical smart sensor solution

On September 11, 2017, the China International Sensor Technology and Application Exhibition kicked off in Shanghai, organized by the China Sensors and Internet of Things Industry Alliance (SIA). The event attracted hundreds of leading Chinese and international sensor companies, all coming together to explore the latest trends and innovations in sensor technology. This was a showcase of diverse sensor technologies and their growing integration with the Internet of Things (IoT), highlighting the industry's dynamic evolution. Goer Co., Ltd., one of China’s largest suppliers of MEMS (Micro-Electro-Mechanical Systems) sensors, made a strong presence at the exhibition. The company displayed its cutting-edge solutions, including industry-leading MEMS microphones, 3D sensing modules, and micro-projection interactive systems. These smart sensor solutions demonstrated Goer’s commitment to innovation and its ability to deliver high-performance, compact, and intelligent sensing technologies. As the only provider of LBS (Laser Beaming Scanning) micro-projection interactive technology in China, Goer showcased its advanced optical design and manufacturing capabilities. At the event, the company presented a micro-projection module based on LBS technology, integrated into the Green Orange VOGA smartphone, as well as an LBS micro-projection plus image interaction module. These products offer benefits such as no focusing requirements, vibrant color saturation, low power consumption, and a compact size. The integrated image interaction function allows any surface to become a touch-enabled interface, expanding human-computer interaction possibilities and opening up new applications in consumer electronics like mobile projectors, smartphones, and AR/VR devices. In addition, Goer exhibited a 3D camera module using Time-of-Flight (TOF) technology, which provides higher resolution and accuracy compared to similar products. This module is ideal for use in VR/AR headsets and other smart devices. The company also introduced its advanced MEMS-based sensors, including air pressure sensors, combined sensors, and heart rate sensors. The air pressure sensor, built using capacitive MEMS technology, boasts the smallest package size (2 x 2 x 0.76mm) and the highest measurement accuracy (up to 0.6Pa), capable of detecting even small height changes. It is widely used in consumer electronics and has gained a leading position in high-precision applications like drones and aircraft models. Goer’s combined sensors integrate microphones, barometers, and temperature sensors, with optimized signal processing and calibration algorithms to eliminate crosstalk and meet multi-functional application needs. The heart rate sensor features a photosensitive unit and ASIC circuit, along with flexible LED configurations and custom high-precision algorithms, making it suitable for a range of wearable devices. As a leader in acoustic MEMS technology, Goer offers complete miniature microphone solutions. Its MEMS microphones are among the top sellers globally, with the company ranking second in the global MEMS microphone market. At the exhibition, Goer also showcased high-performance, small-sized MEMS microphones and microphone array modules, including a 4-microphone array that enhances sound pickup and enables noise cancellation, echo suppression, and beamforming for smart speakers and other audio devices. Being the only Chinese company in the global top 20 MEMS market, Goer has established itself as a strong player with world-class manufacturing capabilities and a wide customer base. Looking ahead, the company will continue to focus on device miniaturization, multi-function integration, and intelligence, from perception to interaction. With a strong emphasis on environmental and health sensing, Goer is continuously strengthening its overall capabilities and striving to become a leading global provider of smart sensing solutions. **Extended Reading:** Acoustic MEMS and Audio Solutions - 2017 Edition Texas Instruments DLP Pico Projection Chipset: DLP nHD, DLP 0.3 WVGA, and DLP 0.17 HVGA

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